TGS-1500 Vecow, Edge AI Computing with robust Industrial PCs

Intel® Core™ Ultra processors (Meteor Lake) feature CPU/GPU/NPU hybrid AI engines, enhancing CPU productivity by up to 14%
Intel® Core™ Ultra processors integrated with maximum 34 TOPS
Multiple HDMI and DisplayPort display interfaces support max 5 independent displays, up to 4K resolution
2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C with DP, 2 USB 2.0, 1 2.5G LAN with Intel® TSN 3 M.2 Socket for storage and expansion
Modular Design for flexible expansion: USB, Isolated DIO, COM, LAN or 4G/LTE
DC 24V Power Input, 0°C to 45°C operation
Supports OpenVINO™ toolkit for AI Computing

Produktnummer: TGS-1500

Hersteller-Nr.: TGS-1500

Hersteller: Vecow

Overview

The Vecow TGS-1000 Series is an ultra-compact, stackable embedded system comprising the TGS-1000 and TGS-1500, both powered by the latest Intel® Core™ Ultra processors. Leveraging the power of Intel® Core™ Ultra processors featuring three dedicated engines—CPU, GPU, and NPU—the TGS-1000 Series accelerates next-generation AI deployments and enhances graphics capabilities at the edge.

The TGS-1000 Series supports up to 96GB of DDR5 memory and offers up to five independent displays through two HDMI and three DP ports. Equipped with a variety of I/O connections, including up to 5 USB 3.0 ports (4Type-A and 1 Type-C) and 1 2.5GigE LAN supporting TSN technology, the TGS-1000 is ideal for vision and automation applications. Another key feature is its modular design, allowing flexible expansion for USB, isolated DIO, COM, LAN, or 4G/LTE, making it ideal for AI, smart retail, office communication, gaming, and more.

The TGS-1000 Series features a compact yet rugged design and supports an operating temperature range of 0°C to 55°C or 0°C to 45°C, with power input range options of 12V to 24V or 24V.

The Vecow TGS-1000 complies with ISO 14067: 2018, the international standard for assessing product carbon footprints during the production process. This reflects our dedication to transparent, measurable, and environmentally responsible manufacturing practices.

Specifications

System
Processor	Intel® Core™ Ultra 7 165H Processor (16 Cores) Intel® Core™ Ultra 5 135H Processor (14 Cores)
NPU	Integrated Intel® AI Boost neural processing unit
Chipset	Intel® SoC
GPU	- Built-in processor graphics Intel® Arc™ GPU - Independent MXM Graphics : By request
BIOS	AMI
SIO	IT8659E
Memory	2 DDR5 5600MHz SO-DIMM, up to 96GB
OS	Windows 11, Windows 10, Linux
I/O Interface
Display	- 2 HDMI 2.1 : Up to 4096 x 2304 @60Hz - 1 DisplayPort 1.4 : Up to 3840 x 2160 @60Hz by USB Type-C - 2 DisplayPort 1.4 : Up to 4096 x 2304 @60Hz (By MXM)
USB	- 2 USB 3.2 Gen 2 Type A - 1 USB 3.2 Gen 2x2 Type C (5V/3A) - 2 USB 2 Type A
LED	Power, HDD
Expansion
M.2	1 M.2 Key E Socket (2230, PCIe x1/USB)
Docking Expansion	2 Expansion Connector for docking module
Storage
M.2	- 1 M.2 Key M Socket (2280, PCIe 4.0 x4) - 1 M.2 Key M Socket (2242, PCIe 4.0 x4)
Audio
Audio Codec	Realtek ALC888S-VD, 7.1 Channel HD Audio
Audio Interface	1 Mic-in, 1 Line-out
Ethernet
LAN	Intel® I226 2.5GigE LAN supports TSN
Power
Power Input	DC 24V
Power Interface	3-pin Terminal Block：V+,V-, Frame Ground
Others
Watchdog Timer	Reset : 1 to 255 sec./min. per step
HW Monitor	Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension	117mm x 120mm x 88.3mm (4.61"x 4.72"x 3.47")
Weight	1.4 kg (3.09 lb)
Mounting	- Wallmount by mounting bracket - VESA Mount (Optional) - DIN Rail Mount (Optional)
Environment
Operating Temperature	0°C to 45°C (-13°F to 113°F), with air flow
Storage Temperature	-40°C to 85°C (-40°F to 185°F)
Humidity	5% to 95% Humidity, non-condensing
Relative Humidity	95% @55°C
Shock/ Vibration	- IEC 61373: 2010 - Railway Applications : Rolling Stock Equipment, Shock and Vibration Tests
EMC	CE, FCC, ICES, EN50155, EN50121-3-2

Feature Highlights

Optimized AI Platform

Intel Core Ultra Processor features performance hybrid architecture with new AI experiences, immersive graphics, and an optimal balance of battery life and performance, delivers max 14% CPU productivity improved and up to 34 TOPS.
Multiple compute engines in one SoC : CPU (6 P-cores, 8 E-cores, 2 Low Power E-cores), GPU (Intel Arc GPU), and NPU (Intel AI Boost).
High-speed DDR5 Memory, up to 96GB
Intel Arc graphics supports DirectX 12.2, OpenGL 4.6, OpenCL 3.0, and Intel® Deep Learning Boost.
High-speed data transfer : USB 3.2 Gen 2x2 Type-C (20G), PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 2.5GigE (2.5G)

Compact Integration

Small Form Factor, compact size
DC 12V to 24V Wide Range Power Input
Multiple HDMI and DisplayPort, max 3 independent displays, up to 4K resolution
2.5GigE LAN, 10G USB 3.2 Gen 2, USB 2.0
Supports Compact M.2 Key M Storage and M.2 Key E Expansion
Smart Manageability : Intel vPro, TCC, TSN, PXE, Wake on LAN
EN50155, EN50121-3-2
OpenVINO toolkits support 500+ AI models optimized for AI Computing

AI Accelerating Options

Optional supports Compact MXM Graphics to boost performance AI and media processing workloads
NVIDIA Ada Lovelace/Ampere/Turing architecture supports max 9728 NVIDIA CUDA cores, 384 Tensor Cores, or 76 RT Cores, delivering max 41.15 TFLOPS peak FP32 performance
Intel Xe HPG microarchitecture delivers 72 TOPS AI performance
Compact MXM Accelerator : NVIDIA RTX A2000 Ada, NVIDIA RTX A2000, NVIDIA Quadro T1000, NVIDIA Quadro RTX 3000, NVIDIA Quadro RTX 5000, NVIDIA Quadro RTX A3500 Ada, NVIDIA Quadro RTX 5000 Ada, Intel Arc A370M

Versatile Configurations

Innovative Stackable Docking design for optional expansion functions
TGS-101 : 16-bit GPIO
TGS-102 : 16-bit Isolated DIO (8 DI, 8 DO)
TGS-104 : 2 Isolated COM RS-232/422/485
TGS-105 : Dual USB 3.0
TGS-106 : Dual 1G LAN
TGS-107 : 4G Module with SIM Socket

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