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  • Produkte
    • INDUSTRIAL COMPUTER
      • Panel PC
        • 7" Panel PC
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        • 12" Panel PC
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        • Arm-based Edge AI Computing
    • INDUSTRIAL CHASSIS
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      • 6U Industrial Chassis
      • Wallmount chassis
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        • Metro Ethernet Switches
    • RAID SYSTEMS
  • Anwendungen
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  • OEM / ODM
  • Kataloge
EVS-3300 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3300 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3300
  • Workstation-grade Platform: Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Intel® Core™ 200S Series with P-core only available (codename: Bartlett Lake 12P)
  • Supports up to a 115W compact NVIDIA® Quadro®/GeForce® MXM graphics card, which delivers with advanced NVIDIA® CUDA® cores.
  • Capable of accommodating 2 NVIDIA®/AMD graphics cards with a maximum power consumption of 200W
  • 2 PCIe x16 Slot with x4 signal, 1 PCIe x8 Slot with x8 signal 
  • 2 Front-access M.2 and 2 2.5" SSD Tray, 1 SIM Socket for wireless network
  • USB 3.2 Gen 2x2 offers max data transfer speeds of 20Gbps
  • Fanless operation in temperatures from -25°C to 55°C
  • DC 9V to 55V wide range power input with Software Ignition Control
  • Supports remote devices Out-of-Band management functions powered by Allxon
EVS-3200 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3200 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3200
  • Workstation-grade Platform: Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Intel® Core™ 200S Series with P-core only available (codename: Bartlett Lake 12P)
  • Supports up to a 115W compact NVIDIA® Quadro®/GeForce® MXM graphics card, which delivers with advanced NVIDIA® CUDA® cores.
  • Capable of accommodating 2 NVIDIA®/AMD graphics cards with a maximum power consumption of 200W
  • 1 PCIe x16 Slot with x8 signal, 1 PCIe x16 Slot with x4 signal
  • 2 Front-access 2.5" SSD Tray, 1 SIM Socket for wireless network
  • USB 3.2 Gen 2x2 offers max data transfer speeds of 20Gbps
  • Fanless operation in temperatures from -25°C to 55°C
  • DC 9V to 55V wide range power input with Software Ignition Control
  • Supports remote devices Out-of-Band management functions powered by Allxon
MIG-3000 Vecow, Edge AI Computing with robust Industrial PCs
MIG-3000 Vecow, Edge AI Computing with robust Industrial PCs
MIG-3000
  • Intel® Core™ i9/i7/i5/i3 Processors (12/13/14th Gen, Raptor/Alder Lake) running with Intel® H610E Chipset supports max 65W TDP CPU
  • 2 DDR5 4800MHz Memory supports up to 64GB
  • 1 M.2 2242/2280 NVMe slot and 2 SATA III ports for storage
  • Expansion: 1 M.2 2230 Key E, 1 PCIe x16 expansion supports up to 900W power budget for independent 2-slot graphics card
  • DC 9V to 55V wide range power input
  • Operating Temperature from 0°C to 60°C
EVS-3400 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3400 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3400
  • Workstation-grade Platform: Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Intel® Core™ 200S Series with P-core only available (codename: Bartlett Lake 12P)
  • Supports up to a 115W compact NVIDIA® Quadro®/GeForce® MXM graphics card, which delivers with advanced NVIDIA® CUDA® cores.
  • Capable of accommodating 2 NVIDIA®/AMD graphics cards with a maximum power consumption of 200W
  • 1 PCIe x16 Slot with x8 signal, 1 PCIe x16 Slot with x4 signal, 2 PCIe x8 Slot with x4 signal 
  • 2 Front-access M.2 and 2 2.5" SSD Tray, 1 SIM Socket for wireless network
  • USB 3.2 Gen 2x2 offers max data transfer speeds of 20Gbps
  • Fanless operation in temperatures from -25°C to 55°C
  • DC 9V to 55V wide range power input with Software Ignition Control
  • Supports remote devices Out-of-Band management functions powered by Allxon


TGS-2500F Vecow, Edge AI Computing with robust Industrial PCs
TGS-2500F Vecow, Edge AI Computing with robust Industrial PCs
TGS-2500F
  • 16-core Intel® Core™ Ultra 300H series processor (Series3, formerly Pather Lake-H) features advanced CPU+GPU+NPU hybrid architecture supporting max 100 TOPS for Edge and Physical AI
  • Innovative stackable design for expansion functions: Optional AI accelerator, USB, Isolated DIO, COM, LAN or 4G/LTE 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 2 2.5GigE LAN
  • 3 M.2 Socket for storage and expansion, supports multiple 5G/WiFi/BT/4G/LTE
  • DC 24V Power Input, max -25°C to 55°C operation
EVS-3000 LIQ Vecow, Workstation Edge AI Computing System with robust industrial PC´s
EVS-3000 LIQ Vecow, Workstation Edge AI Computing System with robust industrial PC´s
EVS-3000 LIQ
  • Workstation-grade Platform: Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Supports up to a 115W MXM GPU with 1 PCIe card expansion
  • USB 3.2 Gen 2x2 offers a max speed of 20Gbps data transfer
  • DC 9V to 55V wide range power input, Software Ignition Control
  • Support remote devices Out-Of-Band management functions powered by Allxon
  • Innovative Liquid Cooling Solution serves 5°C to 65°C fanless


TGS-1500 Vecow, Edge AI Computing with robust Industrial PCs
TGS-1500 Vecow, Edge AI Computing with robust Industrial PCs
TGS-1500
  • Intel® Core™ Ultra processors (Meteor Lake) feature CPU/GPU/NPU hybrid AI engines, enhancing CPU productivity by up to 14%
  • Intel® Core™ Ultra processors integrated with maximum 34 TOPS
  • Multiple HDMI and DisplayPort display interfaces support max 5 independent displays, up to 4K resolution
  • 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C with DP, 2 USB 2.0, 1 2.5G LAN with Intel® TSN 3 M.2 Socket for storage and expansion
  • Modular Design for flexible expansion: USB, Isolated DIO, COM, LAN or 4G/LTE
  • DC 24V Power Input, 0°C to 45°C operation
  • Supports OpenVINO™ toolkit for AI Computing

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