EVS-3300 Vecow, fanless Workstation Edge AI Computing System with robust industrial PC´s
EVS-3300 Vecow, fanless Edge AI Computing System with robust industrial PC´s
- Workstation-grade Platform: Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
- Intel® Core™ 200S Series with P-core only available (codename: Bartlett Lake 12P)
- Supports up to a 115W compact NVIDIA® Quadro®/GeForce® MXM graphics card, which delivers with advanced NVIDIA® CUDA® cores.
- Capable of accommodating 2 NVIDIA®/AMD graphics cards with a maximum power consumption of 200W
- 2 PCIe x16 Slot with x4 signal, 1 PCIe x8 Slot with x8 signal
- 2 Front-access M.2 and 2 2.5" SSD Tray, 1 SIM Socket for wireless network
- USB 3.2 Gen 2x2 offers max data transfer speeds of 20Gbps
- Fanless operation in temperatures from -25°C to 55°C
- DC 9V to 55V wide range power input with Software Ignition Control
- Supports remote devices Out-of-Band management functions powered by Allxon
Produktnummer:
EVS-3300
Hersteller-Nr.:
EVS-3300
Hersteller:
Vecow
Overview
The EVS-3000 Series is a fanless AI computing system featuring the latest Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S). It is equipped with advanced I/O capabilities, including USB Type-C, 2.5G LAN, and up to 4 PCIe slots for expansion. The series is equipped with up to 4 PCIe expansion slot that supports max 200W power of NVIDIA® or AMD graphics engine, ensuring high-performance computing in a robust and durable design. This makes it ideal for applications in autonomous robotics, machine vision, public security, and other edge AI scenarios.
The EVS-3000 series offers versatility with 8 different modules: EVS-3400(F), EVS-3300(F), EVS-3200(F), and EVS-3100(F), providing scalable solutions tailored to specific project needs. For efficient remote management, the series incorporates Out-of-Band management functions powered by Allxon, enhancing remote device management and boosting productivity.
Feature Highlights
High-performance AI Inference Platform
- Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel R680E PCH, max 24-core 65W TDP 5.2GHz CPU supported.
- High-speed DDR5 5600MHz SO-DIMM, up to 96GB ECC/non-ECC Memory.
- Supports performance hybrid architecture and advanced AI capabilities for smarter and faster applications.
- Intel UHD Graphics 770 supports DirectX 12, OpenGL 4.5, OpenCL 3.0.
- Compact MXM Graphics card supports NVIDIA Ada Lovelace/Ampere/Turing architecture, empowers outstanding AI computing productivity with max 9728 CUDA Cores, 76 RT Cores, and 304 Tensor Cores, delivers 41.15 TFLOPS peak FP32 performance.
- High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2x2 Type-C (20G), USB 3.2 Gen 2 (10G), SATA III (6G), 2.5GigE LAN (2.5G)
Advanced Integration
- Compact & fanless design.
- Intel Deep Learning Boost for accelerated AI performance.
- Intel Turbo Boost Technology 2.0 accelerates processor performance on peak loads.
- Optional supports low-profile discrete graphics card or AI accelerator, max 307 AI TOPS, 6144 CUDA cores, 192 Tensor cores, 48 RT cores.
- 32 Isolated DIO : 16 DI, 16 DO.
- Supports Intel vPro, TPM 2.0, PXE, Wake on LAN for remote control.
- Supports TSN and Intel TCC for real-time control.
- OpenVINO toolkits support 500+ AI models optimized for AI Computing.
- Supports remote device Out-Of-Band management functions powered by Allxon.
Trusted Reliability
- EN50155, EN50121-3-2, ICES, CE, FCC certified
- Fanless -25°C to 55°C operation.
- Anti-shock & Anti-vibration : IEC 60068-2-27, ICE 60068-2-64, MIL-STD-810G.
- DC 9V to 55V wide range power input.
- Software Ignition Power Control for in-vehicle application.
- Supports 5G/WiFi/BT/4G/LTE/GPRS/UMTS wireless data transfer.
- Trusted Longevity supports.
- Max 200W power budget for discrete graphics card.
Diversity of Configurations
- Max 4 PCIe 4.0 expansions : 1 PCIe x8, 3 PCIe x4
- Lockable Storage : Front-access M.2 SSD Tray, Front-access 2.5" SSD Tray.
- Multiple compact M.2 connections for Storage and Expansion.
- Optional supports levels of Low-profile graphics card.
- Versatile product configuration for project requirements.
- PCIe expansions for multiple 10GigE M12 PoE+ LAN, 10GigE PoE+ LAN, 10GigE LAN, 10G SFP+, 2.5GigE PoE+ LAN, 2.5GigE LAN, M12 PoE+ LAN, PoE+ LAN, GigE LAN, LAN Switch, USB, or Discrete Graphics.
Specifications
| System | |
| Processor | - 24-core Intel® Core™ 200S Series Processor (Bartlett Lake-S) - 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh) - 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S) - 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S) |
| Chipset | Intel® R680E Chipset |
| BIOS | AMI |
| SIO | IT8786E |
| Memory | 2 DDR5 5600MHz SO-DIMM, up to 96GB (ECC/Non-ECC) |
| OS | Windows 11, Windows 10, Linux |
| I/O Interface | |
| Serial | 2 COM RS-232/422/485 (ESD 8kV) |
| USB | - 4 USB 3.2 Gen 2 Type A - 1 USB 3.2 Gen 2x2, USB Type-C supports max 20Gbps data transfer (15W, 5V/3A) |
| Isolated DIO | 32 Isolated DIO (16 DI, 16 DO) |
| LED | Power, HDD, OOB |
| SIM Card | 1 External SIM Card Socket for 5G/4G/LTE/GPRS/UMTS wireless network |
| Expansion | |
| PCIe | - 2 PCIe x16 Slot with x4 signal - 1 PCIe x8 Slot with x8 signal |
| M.2 | - 1 M.2 Key B Socket (2280/3042/3052, PCIe/USB 3, default/SATA) - 1 M.2 Key E Socket (2230, PCIe/USB) |
| Graphics | |
| Graphics Processor | Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture |
| Interface | Up to 7 independent displays: - 2 HDMI 2.1: Up to 4096 x 2304 @60Hz - 1 DP: Up to 3840 x 2160 @60Hz - 4 DP: Up to 3840 x 2160 @60Hz (By requested MXM) |
| Storage | |
| SATA | 2 SATA III (6Gbps) support S/W RAID 0, 1, with 2 Front-access 2.5" SSD/HDD Tray |
| M.2 | - 1 M.2 Key M Socket (2280, PCIe x4) - 2 Front-access M.2 Key M SSD Tray |
| Audio | |
| Audio Codec | Realtek ALC888S-VD, 7.1 Channel HD Audio |
| Audio Interface | 1 Mic-in, 1 Line-out |
| Ethernet | |
| LAN 1 | Intel® I226 2.5GigE LAN supports TSN |
| LAN 2 | Intel® I226 2.5GigE LAN supports TSN |
| Power | |
| Power Input | DC 9V to 55V |
| Power Interface | 3-pin Terminal Block : V+, V-, Frame Ground |
| Ignition Control | 16-mode Software Ignition Control |
| Remote Switch | 3-pin Terminal Block |
| Out-of-Band Management | |
| MCU | Nuvoton NUC980 |
| Interface | OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector |
| Remote Management | Support Remote Power ON/OFF, Reset and Power Cycling |
| Others | |
| TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
| Watchdog Timer | Reset : 1 to 255 sec./min. per step |
| Smart Management | Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| Mechanical | |
| Dimension | EVS-3300: 280mm x 130mm x 215mm (11.02"x 5.19"x 8.46") EVS-3300F: 280mm x 137mm x 215mm (11.02"x 5.39"x 8.46") |
| Weight | EVS-3300: 6.2 kg (13.67 lb) EVS-3300F: 6.3 kg (13.89 lb) |
| Mounting | - Wallmount by mounting bracket - VESA Mount (Optional) - DIN Rail Mount (Optional) - Rackmount (Optional) |
| Environment | |
| Operating Temperature | - 35W TDP CPU: -25°C to 55°C (-13°F to 131°F) with air flow - 65W TDP CPU: -25°C to 45°C (-13°F to 113°F) with air flow |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) |
| Humidity | 5% to 95% Humidity, non-condensing |
| Relative humidity | 95% at 55°C |
| Shock | - IEC 60068-2-27 - SSD: 50G @wallmount, Half-sine, 11ms - MIL-STD-810G method 514.6, Category 4 (with PCIe Card) |
| Vibration | - IEC 60068-2-64 - SSD: 5Grms, 5Hz to 500Hz, 3 Axis - MIL-STD-810G method 516.6, Procedure I (with PCIe Card) |
| EMC | CE, FCC, ICES, EN50155, EN50121-3-2 |