EAC-2000 Vecow, Edge AI Computing with robust Industrial PCs
EAC-2000 Vecow, Edge AI Computing with robust Industrial PCs
- Small form factor NVIDIA® Jetson Xavier™ NX supports up to 21 TOPS AI performance
- Advanced NVIDIA Volta™ architecture with 384 NVIDIA® CUDA® cores and 48 Tensor cores
- Fanless -20°C to 70°C operation 4 GigE LAN with 2 PoE+, 4 USB 3.1, 1 Digital Display
- M.2 for 5G/4G/LTE/WiFi/BT/GPRS/UMTS
- Storage : M.2 PCIe NVMe SSD, External Micro SD
- DC 9V to 50V wide range power input Tested to MIL-STD-810G for shock and vibration
- Support 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
Produktnummer:
EAC-2000
Hersteller-Nr.:
EAC-2000
Hersteller:
Vecow
Overview
EAC-2000/2100 is a compact AI computing system powered by NVIDIA® Jetson Xavier™ NX, delivering a powerful computing performance with up to 21 TOPS. Featuring advanced NVIDIA Volta™ GPU with 384 NVIDA® CUDA® Core and 48 Tensor Cores, Vecow EAC-2000/2100 helps to accelerate the implementation of AI applications at the edge. Equipped with Fakra-Z connectors and support for an extended operating temperature range of -20°C to 70°C, Vecow EAC-2000/2100 is ideal to meet the requirements of automotive applications and any AIoT applications.
Specifications
| System | |
| CPU | 6-core NVIDIA Carmel ARM® v8.2 64-bit CPU |
| GPU | 384-core NVIDIA Volta™ GPU with 48 Tensor Cores |
| DL Accelerator | 2x NVDLA Engines |
| Memory | 1 LPDDR4x DRAM, 8GB |
| Software Support | - Linux - NVIDIA JetPack SDK |
| I/O Interface | |
| USB | 4 USB 3.1 Type A |
| Serial | 2 COM RS-232/485 |
| Micro USB | - 1 Micro USB console debug port - 1 Micro USB OS flash port |
| Button | - 1 User-Define Button - 1 Force Recovery Button |
| LED | 2 PoE, 2 User Programming |
| SIM | 1 Nano SIM Card Socket |
| Antenna | 6 Antenna for 5G/WiFi/4G/LTE/GPRS/UMTS |
| Expansion | |
| M.2 | - 1 M.2 Key B Socket (3042/3052, PCIe/USB3) - 1 M.2 Key E Socket (2230, PCIe/USB) |
| Graphics | |
| Interface | 1 Digital Display, up to 3840 x 2160 @60Hz |
| Video Encode | - HEVC: Up to 2x2160p @60, 4x2160p @30, 10x1080p @60, 22x1080p @30 - H.264: Up to 2x2160p @60, 4x2160p @30, 10x1080p @60, 20x1080p @30 |
| Video Decode | - HEVC: Up to 2x4320p @30, 6x2160p @60, 12x2160p @30, 22x1080p @60, 44x1080p @30 - H.264: Up to 2x2160p @60, 6x2160p @30, 10x1080p @60, 22x1080p @30 |
| Storage | |
| M.2 | 1 M.2 Key M Socket (2280, PCIe x1) |
| eMMC | 1 eMMC 5.1, 16GB |
| SD | 1 Micro SD (External) |
| Ethernet | |
| LAN 1 | 10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector |
| LAN 2 | 10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector |
| PoE | |
| LAN 3 | IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
| LAN 4 | IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector |
| Power | |
| Power Input | DC 9V to 50V |
| Power Interface | 3-pin Terminal Block : V+, V-, Frame Ground |
| Mechanical | |
| Dimensions (W x L x H) | 150.0mm x 106.2mm x 50.0mm (5.92" x 4.18" x 1.97") |
| Weight | 1.2 kg (2.6lb) |
| Mounting | - Wallmount by mounting bracket - DIN Rail Mount (Optional) |
| Environment | |
| Operating Temperature | 15W TDP Mode : -20°C to 65°C (-4°F to 149°F), with air flow 10W TDP Mode : -20°C to 70°C (-4°F to 158°F), with air flow |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) |
| Humidity | 5% to 95% Humidity, non-condensing |
| Relative Humidity | 95% @ 70°C |
| Shock | Operating, MIL-STD-810G, Method 516.7, Procedure I |
| Vibration | Operating, MIL-STD-810G, Method 514.7, Procedure I, Category 4 |
| EMC | CE, FCC |
