AIoT Industrial Automation

AIoT Industrial Automation

KI in der Produktion ermöglicht Optimierung von Zeit, Kosten und Qualität. Der Einsatz von KI kann die Produktivität steigern, wenn Qualitätskontrollen vereinfacht werden, Ausschussraten (Predictive Quality und Predictive Maintenance) verbessert und und die frühzeitige Erkennung von Anomalien von Maschinen und Anlagen erfolgt. Die Schnittstelle zwischen Mensch und Maschine wird optimaler gemanagt

NAC-1000

Advanced NVIDIA® Jetson AGX Orin™ platform delivers up to 275 TOPS AI performance
Based on NVIDIA Nova Orin™, fully supports NVIDIA Isaac™ Perceptor Software Stack for AI Robot Development on NVIDIA Isaac™ ROS
Supports 8 GMSL 1/2 automotive cameras with Fakra-Z connectors
1 1000Base-T1 LAN, 4 M12 PoE+ GigE LAN
Built-in Bosch 6-axis IMU, Altimeter, Magnetometer
Supports multiple 5G/4G/WiFi/BT/LTE/GPRS/UMTS wireless connection
IP66, DC 9V to 50V, Software Ignition Power Control

MIG-3000 Vecow

MIG-3000

Intel® Core™ i9/i7/i5/i3 Processors (12/13/14th Gen, Raptor/Alder Lake) running with Intel® H610E Chipset supports max 65W TDP CPU
2 DDR5 4800MHz Memory supports up to 64GB
1 M.2 2242/2280 NVMe slot and 2 SATA III ports for storage
Expansion: 1 M.2 2230 Key E, 1 PCIe x16 expansion supports up to 900W power budget for independent 2-slot graphics card
DC 9V to 55V wide range power input
Operating Temperature from 0°C to 60°C

EAC-7000

NVIDIA® Jetson T5000™ module, up to 2,070 FP4 TFLOPS
NVIDIA Isaac™ Perceptor Software Stack for AI Robot Development on NVIDIA Isaac™ ROS
NVIDIA Holoscan Sensor Bridge for low-latency various cameras and sensors data processing
Up to 16 GMSL 1/2 automotive cameras with Fakra-Z connectors
Up to 4 10GigE, 2 2.5GigE, 4 GigE LAN with 4 PoE+
4 Isolated CAN-FD, 2 COM RS232/422/485, 4 USB 3.1, 16-bit Isolated DIO (8 DI, 8 DO)
Multiple 5G/4G/LTE/WiFi/BT/GPRS/UMTS connections
Device remote management by Allxon

EAC-4000

NVIDIA Jetson Orin™ NX/Nano, up to 100 TOPS AI performance (Orin Nano Super Mode Supported)
Up to 16GB LPDDR5 RAM, 128GB NVMe SSD
1 GigE LAN, 4 USB 3.1, 1 HDMI 2.0
2 COM RS-232/422/485
1 Full-size Mini PCIe with SIM for 4G/Wi-Fi/BT

GH-402ATXR GUANGHSING 19" (19 Zoll) 4U/4HE Rackmount Chassis ATX Depth 451mm with 2 x hot-swap fans

GH-402SX

4U, 19" chassis industrial grade
Depth 451mm
ATX form up to 12" x 9.6" M/B
for PS/2 single ATX or miniredundant rear installation power supply
Color black, with front lockable door on drive panel

TGS-2500F Vecow

TGS-2500F

16-core Intel® Core™ Ultra 300H series processor (Series3, formerly Pather Lake-H) features advanced CPU+GPU+NPU hybrid architecture supporting max 100 TOPS for Edge and Physical AI
Innovative stackable design for expansion functions: Optional AI accelerator, USB, Isolated DIO, COM, LAN or 4G/LTE 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 2 2.5GigE LAN
3 M.2 Socket for storage and expansion, supports multiple 5G/WiFi/BT/4G/LTE
DC 24V Power Input, max -25°C to 55°C operation

GHI-210H GUANGHSING 2HE 19 Zoll Industrie-Gehäuse ATX 3x horizontale Slots

GHI-210HSX-G

2HE, 19 Zoll Industriegehäuse
Tiefe 450mm
ATX, max. 12" x 9.6" M/B
für 2HE Single ATX or Redundant Netzteile
Farbe: Schwarz

TGS-1500 Vecow

TGS-1500

Intel® Core™ Ultra processors (Meteor Lake) feature CPU/GPU/NPU hybrid AI engines, enhancing CPU productivity by up to 14%
Intel® Core™ Ultra processors integrated with maximum 34 TOPS
Multiple HDMI and DisplayPort display interfaces support max 5 independent displays, up to 4K resolution
2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C with DP, 2 USB 2.0, 1 2.5G LAN with Intel® TSN 3 M.2 Socket for storage and expansion
Modular Design for flexible expansion: USB, Isolated DIO, COM, LAN or 4G/LTE
DC 24V Power Input, 0°C to 45°C operation
Supports OpenVINO™ toolkit for AI Computing