AI Logistics
Durch entsprechende Lösungen wird Planung smarter gesteuert und Lagerhaltung optimiert. Vorteile von AI Logistics sind mehr Effizienz durch weniger Überbestand und Senkung der Lagerkosten. Die Logistik mit ihren weitverzweigten Netzwerken ist ein ideales Anwendungsfeld für Künstliche Intelligenz. Mit intelligent ausgewerteten Daten lassen sich beispielsweise zukünftige Produktions- und Transportmengen prognostizieren.
MIG-3000 Vecow
MIG-3000
- Intel® Core™ i9/i7/i5/i3 Processors (12/13/14th Gen, Raptor/Alder Lake) running with Intel® H610E Chipset supports max 65W TDP CPU
- 2 DDR5 4800MHz Memory supports up to 64GB
- 1 M.2 2242/2280 NVMe slot and 2 SATA III ports for storage
- Expansion: 1 M.2 2230 Key E, 1 PCIe x16 expansion supports up to 900W power budget for independent 2-slot graphics card
- DC 9V to 55V wide range power input
- Operating Temperature from 0°C to 60°C
TGS-2500F Vecow
TGS-2500F
- 16-core Intel® Core™ Ultra 300H series processor (Series3, formerly Pather Lake-H) features advanced CPU+GPU+NPU hybrid architecture supporting max 100 TOPS for Edge and Physical AI
- Innovative stackable design for expansion functions: Optional AI accelerator, USB, Isolated DIO, COM, LAN or 4G/LTE 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 2 2.5GigE LAN
- 3 M.2 Socket for storage and expansion, supports multiple 5G/WiFi/BT/4G/LTE
- DC 24V Power Input, max -25°C to 55°C operation
TGS-1500 Vecow
TGS-1500
- Intel® Core™ Ultra processors (Meteor Lake) feature CPU/GPU/NPU hybrid AI engines, enhancing CPU productivity by up to 14%
- Intel® Core™ Ultra processors integrated with maximum 34 TOPS
- Multiple HDMI and DisplayPort display interfaces support max 5 independent displays, up to 4K resolution
- 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C with DP, 2 USB 2.0, 1 2.5G LAN with Intel® TSN 3 M.2 Socket for storage and expansion
- Modular Design for flexible expansion: USB, Isolated DIO, COM, LAN or 4G/LTE
- DC 24V Power Input, 0°C to 45°C operation
- Supports OpenVINO™ toolkit for AI Computing